Recently, Yuexin Technology secured a major partnership with a leading domestic memory chip manufacturer, receiving an ATE test equipment order valued at over 15 billion RMB. The core products are the company's self-developed TM8000 series test systems. As China's first production and testing system supporting high-performance memory chips including LPDDR, DDR, and HBM, this model has successfully completed rigorous line acceptance assessments across multiple top-tier clients, including engineering validation, mass production performance verification, and LVM production data comparison. These validations comprehensively confirm key metrics such as system stability, test consistency, data correlation, liquid cooling and electrical reliability, software functionality completeness, parallel testing efficiency, and EAP system support capabilities.
China's domestic memory chip industry is now transitioning from "technology catch-up" to "mass production scaling." Leading DRAM manufacturers have surpassed hundreds of thousands of wafers in monthly capacity, with global market share rising from less than 3% to over 7.7%. Their product portfolios cover the full DDR4, DDR5, and LPDDR5/5X series. At the same time, the explosive growth of large AI models is reshaping the storage landscape. High Bandwidth Memory (HBM), a critical component for AI chips, has become a strategic battleground where global vendors are competing fiercely. The supply-demand gap continues to widen, and domestic manufacturers are accelerating R&D and mass-production preparations for HBM. It is projected that by 2027, China's memory chip market size will exceed 3000 billion yuan. Rapid capacity expansion is driving exponential growth in demand for upstream equipment, particularly in testing. Due to TSV-based 3D stacking packaging, HBM presents significantly higher test complexity and cycle times compared to traditional memory dies, imposing stricter requirements on test equipment.
However, as the core equipment for back-end chip manufacturing, ATE test systems have lagged significantly behind front-end production equipment in terms of domestic localization. In the storage chip ATE testing market, two global leaders—Advantest (Japan) and Teradyne (U.S.)—collectively hold over 90% of the global market share. The domestic localization rate for storage ATE testing equipment remains below 8%, making it one of the weakest links in achieving self-reliance within semiconductor manufacturing equipment. This long-standing bottleneck stems from exceptionally high market and technical barriers: ATE systems must simultaneously support high-speed digital signal processing and high-precision signal measurement, large-scale parallel testing architectures, and complex repair algorithms. They also require validation by top-tier global chip manufacturers, deep integration into their production systems, and the ability to meet stringent demands for 7×24-hour continuous stable operation. On automated production lines shipping billions of chips annually, a test system's stability, consistency, and response speed directly determine a manufacturer's capacity utilization.
